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MECHANIC ISM3 Jump Wire Specific Solder Paste (with Flux) Low Temp 138C/183C Solder Tin Paste Repair Phone Rework BGA

has variants

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id 51656370469first seen 29 Apr 2026, 10:46 pmlast seen 2mo agodetail 2mo ago

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tracked: not enough snapshots yetlatest 2mo ago

Latest price

RM25.90

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Variants

Sold count history

last 90 days

Price range history

last 90 days

Variants

2 active

Variant	Price	Δ	Stock	First seen	Updated
138c	RM25.90	RM0.00	in stock	2mo ago	2mo ago
185c	RM28.90	RM0.00	in stock	2mo ago	2mo ago

Variant price history

last 365 days · sampled by weekly scan:full

138c185c

Description

Introduction:

The MECHANIC iSm3 Special Solder Paste is expertly formulated using Japanese technology, designed for industrial-grade mobile phone repairs. Featuring high-activity nanocompounds, this solder paste delivers exceptional precision and efficiency when working with jumper wires in mobile devices. Its moderate viscosity allows for easy application, and the paste seamlessly adheres to the solder spot with minimal effort, ensuring a quick and reliable bond.

Specifications:

Product Name: MECHANIC iSM3 Special Solder Paste
Volume: 3ML
Temperature Range: 138-158 ℃ / 138-210 ℃ 
Includes: 3pcs Needle for precise application


Features:
High activity for efficient tinning
Easy to tin with a single stamp of the iron head
Ideal for phone jumper wire soldering
Full, smooth tin points without gaps or bubbles
Perfect for intricate phone repairs like flying lines